As the mobile device chipmakers eye the internet of things (IoT) for growth, lowering power consumption moves from a key concern to an obsession. In that environment, successful migration to new process technologies is as critical as the latest chip design, and the silicon vendors, and their foundries, are making the leap to the processes which will enable a new wave of ultra-low power connected devices. The current leap is to 14/16-nanometer geometries with FinFET, a 3D system of stacking transistors which allows for greater density, reducing size and power. Over the horizon, 10nm beckons. All the foundries, and the major manufacturers like Intel, have recently been outlining their roadmaps, and at the Freescale Technology Forum this week, the announcement…